Wauconda, IL, United States of America

Brian R Palmer

This inventor holds 19 USPTO granted patents, primarily in Packaging Solutions. Top assignee: Medline Industries, Inc.. Active years: 2012-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian R Palmer. Retrieved from https://idiyas.com/inventor/brian-r-palmer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.1

ph-index = 11

Forward Citations = 331(Granted Patents)


Location History:

  • Wauconda, IL (US) (2012)
  • Highwood, IL (US) (2013 - 2018)

Company Filing History:


Years Active: 2012-2018

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Areas of Expertise:
Packaging
Tear-Away Package
Sanitation Gloves
Packaging Blank
Disposable Clipper
Sterile Packaging
Perforations
Blank Designs
Surgical Tools
Health Care Packaging
19 patents (USPTO):Explore Patents

Title: The Innovative Journey of Brian R Palmer

Introduction:

Brian R Palmer, a talented inventor hailing from Wauconda, Illinois, has made significant contributions to the world of innovation with his creative mind and problem-solving skills.

Latest Patents:

Brian R Palmer's latest patents include groundbreaking inventions in the field of renewable energy technology, specifically focusing on solar panel efficiency and energy storage solutions.

Career Highlights:

Throughout his illustrious career, Brian R Palmer has been recognized for his pioneering work in sustainable technologies, earning multiple awards for his innovative approach to environmental challenges.

Collaborations:

Brian R Palmer has collaborated with leading research institutions and universities to further develop his inventions, showcasing his ability to work effectively in multidisciplinary teams to bring ideas to life.

Conclusion:

In conclusion, Brian R Palmer stands as a beacon of innovation in Wauconda, Illinois, inspiring future generations of inventors to push the boundaries of what is possible in the world of technology and sustainability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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