Brecksville, OH, United States of America

Brian R Campbell

This inventor holds 2 USPTO granted patents. Top assignee: Rockwell Automation Technologies Incorporated. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian R Campbell. Retrieved from https://idiyas.com/inventor/brian-r-campbell-s8d54vn8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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2 patents (USPTO):Explore Patents

Title: Brian R Campbell: Innovator in Digital Communications

Introduction

Brian R Campbell is a notable inventor based in Brecksville, OH (US). He has made significant contributions to the field of digital communications, particularly through his innovative patent that addresses common-mode interference.

Latest Patents

One of Campbell's key patents is titled "Common mode termination matching method for digital communications." This invention describes a common-mode interference dissipation circuit designed to provide immunity to electrical interference, such as common mode impedance interference. The circuit includes one or more variable resistors and a capacitor, which work together to mitigate interference in industrial automation environments.

Career Highlights

Throughout his career, Campbell has focused on developing solutions that enhance the reliability of digital communication systems. His work has been instrumental in improving the performance of electronic devices in various applications.

Collaborations

Campbell has collaborated with talented individuals in his field, including Haihui Lu and David Dale Brandt. These partnerships have contributed to the advancement of technology in digital communications.

Conclusion

Brian R Campbell's innovative work in digital communications, particularly his patent for common-mode interference dissipation, showcases his commitment to enhancing electronic reliability. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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