This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Brian Narkinsky: Innovator in 3D Printing Technology
Introduction
Brian Narkinsky is a notable inventor based in Tallahassee, FL (US). He has made significant contributions to the field of 3D printing, particularly with his innovative approach to adjusting print infill specifications based on stress points in device designs. His work is paving the way for more efficient and effective 3D printing processes.
Latest Patents
Brian Narkinsky holds a patent for "Dynamic print infill adjustment for determined stress points." This patent describes systems and methods for implementing 3D printing to manufacture objects with dynamic adjustments to print infill specifications. The method involves receiving a 3D object design, determining regions of potential human interaction, and generating instructions to adjust print infill specifications accordingly. This innovation enhances the structural integrity of 3D printed devices.
Career Highlights
Brian is currently employed at International Business Machines Corporation, commonly known as IBM. His role at IBM allows him to collaborate with other talented professionals in the field of technology and innovation. He has made strides in advancing 3D printing technology through his research and development efforts.
Collaborations
Some of Brian's coworkers include Logan Bailey and Wesley Ip. Their collaboration fosters a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Brian Narkinsky's contributions to 3D printing technology exemplify the spirit of innovation. His patent on dynamic print infill adjustment showcases his commitment to enhancing manufacturing processes. Through his work at IBM, he continues to push the boundaries of what is possible in the realm of 3D printing.