Chicago, IL, United States of America

Brian Montague

This inventor holds 1 USPTO granted patent. Top assignee: The Boeing Company. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Montague. Retrieved from https://idiyas.com/inventor/brian-montague

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Brian Montague: Inventor of a Damped Cantilever Assembly

Introduction

Brian Montague is an inventor based in Chicago, Illinois, and is associated with The Boeing Company. His patent work addresses mechanical damping in cantilever assemblies, with a design intended to limit unwanted resonant motion.

Latest Patents

Montague is named on 1 patent: “Cantilever Assemblies and Methods of Providing Damping for Cantilever Assemblies.” The disclosed assembly includes a cantilever with an anchor, an arm, and a tip. At the tip, a hollow conductive tube houses a magnet suspended between two springs. The magnet can move coaxially within the tube, while the springs support its motion. This arrangement functions as a tuned mass damper, helping limit the cantilever assembly’s resonant response.

Career Highlights

Montague’s listed invention focuses on integrating a tuned mass damper into a cantilever assembly. By using a magnet and springs within a hollow conductive tube, the design provides a compact approach to reducing resonance.

Collaborations

Montague’s listed coworkers include Randall L. Mosten and Michael K. Klein. The patent reflects collaborative innovation associated with The Boeing Company.

Conclusion

Brian Montague’s patent describes a spring-supported magnet that acts as a tuned mass damper, illustrating a practical approach to controlling resonance in cantilever assemblies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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