Lyons, CO, United States of America

Brian Lee Rappel

This inventor holds 12 USPTO granted patents. Top assignees: Dphi Acquisitions, Inc., Western Digital Technologies, Inc., Other. Active years: 2004-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Lee Rappel. Retrieved from https://idiyas.com/inventor/brian-lee-rappel-xr72wmtj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 58.3

Average Co-Inventor Count = 3.8

ph-index = 5

Forward Citations = 169(Granted Patents)


Company Filing History:


Years Active: 2004-2017

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12 patents (USPTO):Explore Patents

Title: The Innovative Journey of Brian Lee Rappel

Introduction:

Brian Lee Rappel, a talented inventor hailing from Lyons, CO (US), has made significant contributions to the world of innovation with his creative mind and passion for problem-solving.

Latest Patents:

Brian Lee Rappel's latest patents include groundbreaking inventions in the field of renewable energy technology, sustainable agriculture, and advanced materials science.

Career Highlights:

Throughout his illustrious career, Brian Lee Rappel has been recognized for his pioneering work in developing cutting-edge solutions for environmental challenges. His innovative spirit has led to the creation of patents that have revolutionized various industries.

Collaborations:

Brian Lee Rappel has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His partnerships have been instrumental in turning his visionary ideas into tangible products that have a positive impact on society.

Conclusion:

In conclusion, Brian Lee Rappel stands as a shining example of an inventor who has dedicated his life to pushing the boundaries of innovation. His passion for creating a better world through technology continues to inspire the next generation of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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