Brian L Rowden

Title: Brian L Rowden: Innovator in Surface Mount Technology

Introduction

Brian L Rowden is a notable inventor based in Fayetteville, NY (US). He has made significant contributions to the field of surface mount technology, particularly with his innovative designs that enhance the performance of integrated circuit devices.

Latest Patents

Brian holds a patent for a surface mount ceramic package. This invention is designed for microwave or millimeter wave integrated circuit devices. The package features outer conductive pads that allow for direct connection with traces on the printed circuit board. It includes a metal core with voids or cutouts where the outer pads are located. The design incorporates a first ceramic layer with a central cavity for the die and a second ceramic layer. Printed traces are buried between these layers, with vias connecting the traces to the outer pads. Inner pads are positioned on a ledge of the first layer for connection with the die's electrodes. This construction effectively minimizes inductive losses, especially at higher frequencies.

Career Highlights

Brian is currently associated with Dover Capital Formation Group, where he applies his expertise in developing advanced electronic packaging solutions. His work has been instrumental in pushing the boundaries of surface mount technology.

Collaborations

Brian has collaborated with notable colleagues, including David A Bates and Stephen J Oot, contributing to various projects that enhance the capabilities of electronic devices.

Conclusion

Brian L Rowden's innovative work in surface mount technology exemplifies the impact of dedicated inventors in advancing electronic solutions. His patent for a surface mount ceramic package showcases his commitment to improving device performance and efficiency.