Brian L Bex

Title: Brian L Bex: Innovator in Lapping Technology

Introduction

Brian L Bex is a notable inventor based in Camas, WA (US). He has made significant contributions to the field of lapping technology, particularly through his innovative patent. His work focuses on enhancing the fabrication of lapping carriers, which are essential in the semiconductor industry.

Latest Patents

Brian L Bex holds a patent for a "Lapping carrier, apparatus for lapping a wafer and method of fabricating a lapping carrier." This patent outlines a method of fabricating a lapping carrier that includes defining at least one opening through a workpiece sized to receive a wafer. The process involves cryogenically tempering the workpiece to enhance the conversion of its crystalline structure to a martensite crystalline structure, thereby improving the hardness of the lapping carrier. The patent also describes an apparatus for lapping a wafer that includes a hardened lapping carrier and at least one lapping plate for processing wafers.

Career Highlights

Brian L Bex has made a mark in the industry through his work at Seh America, Inc. His innovative approach to lapping technology has positioned him as a key figure in the development of advanced semiconductor manufacturing processes.

Collaborations

Brian collaborates with David K Chen, contributing to the advancement of lapping technology and its applications in the semiconductor field.

Conclusion

Brian L Bex is a distinguished inventor whose contributions to lapping technology have had a significant impact on the semiconductor industry. His innovative methods and dedication to enhancing manufacturing processes continue to influence the field.