Brian K Burnor

Title: Brian K Burnor: Innovator in Solder Bump Process Technology

Introduction

Brian K Burnor is a notable inventor based in Fairfax, Vermont, who has made significant contributions to the field of solder bump processes. With a total of 2 patents, Burnor's work focuses on enhancing the precision and efficiency of mask and substrate alignment.

Latest Patents

One of Burnor's latest patents is a system for aligning a mask to a substrate. This innovative system includes a fixture that holds both the mask and substrate in fixed positions relative to each other. It features means for holding the substrate that protrudes through openings in a table and the fixture. The system also includes a stage that is movable in two directions and rotatable about an axis relative to the table. Additionally, it has means for affixing the fixture to the table and controlling the temporary affixing to generate a uniform force around the perimeter of the fixture. This ensures precise alignment of the mask to the substrate, enhancing the overall solder bump process.

Career Highlights

Brian K Burnor is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to contribute to advancements in the field of electronics and manufacturing.

Collaborations

Throughout his career, Burnor has collaborated with notable colleagues, including Duane E Allen and Thomas A Dotolo. These collaborations have further enriched his work and contributed to the success of various projects.

Conclusion

Brian K Burnor is a distinguished inventor whose contributions to solder bump process technology have made a significant impact in the industry. His innovative patents and work at IBM highlight his dedication to advancing technology in electronics manufacturing.