Dayton, OH, United States of America

Brian J Knouff


Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Brian J Knouff: Innovator in Composite Spring Technology

Introduction

Brian J Knouff is a notable inventor based in Dayton, Ohio. He has made significant contributions to the field of vehicle suspension systems through his innovative designs. His work focuses on enhancing the performance and durability of automotive components.

Latest Patents

Brian J Knouff holds a patent for a "Composite spring with resilient attachment interface." This invention involves a leaf spring designed for vehicle suspension, constructed from composite materials. The spring features first and second ends that are longitudinally spaced apart. A resilient element is attached to at least one of these ends, which includes a hole for a connecting element. This design allows for effective attachment of the leaf spring to a vehicle structure. In one embodiment, the resilient element is a rubber block bonded to the leaf spring. In another, it is a longitudinally oriented bushing inserted through the thickness of the spring.

Career Highlights

Brian is currently associated with Arvin Meritor Technology, LLC, where he applies his expertise in developing advanced automotive technologies. His work has contributed to improving vehicle performance and safety.

Collaborations

Throughout his career, Brian has collaborated with talented individuals such as David K Platner and Arnett Ryan Weber. These partnerships have fostered innovation and the development of cutting-edge technologies in the automotive sector.

Conclusion

Brian J Knouff is a distinguished inventor whose work in composite spring technology has made a significant impact on vehicle suspension systems. His innovative designs continue to influence the automotive industry.

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