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For the Inventor, By the Inventor

Seattle, WA, United States of America

Brian Hoffman

This inventor holds 15 USPTO granted patents. Top assignee: Amazon Technologies, Inc.. Active years: 2019-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Hoffman. Retrieved from https://idiyas.com/inventor/brian-hoffman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15

% Patents Active = 80.0

Average Co-Inventor Count = 2.7

ph-index = 5

Forward Citations = 75(Granted Patents)


Company Filing History:

goldMedal15 out of 23,655 
 
Amazon Technologies, Inc.
 patents

Years Active: 2019-2023

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15 patents (USPTO):Explore Patents
1. 11851218 - Material handling apparatus (2023-12-26),
2. 11597552 - Right-sized thermoformed cavities for packaging items (2023-03-07),
3. 11485533 - Vacuum-assisted item bundling system (2022-11-01),
4. 11390445 - Packaging products and associated material (2022-07-19),
5. 11130620 - Cushioned packaging materials, cushioned packages, and related methods (2021-09-28),
6. 11123944 - Packaging items using customized 3D-printed dunnage (2021-09-21),
7. 11123771 - Automated modular system for sorting items (2021-09-21),
8. 11084637 - Cushioned packaging materials, cushioned packages, and related methods (2021-08-10),
9. 10989282 - Constant force robotic dresspack (2021-04-27),
10. 10967995 - Inflatable packaging materials, automated packaging systems, and related methods (2021-04-06),
11. 10773839 - Methods for packaging items and preparing packaging materials (2020-09-15),
12. 10717583 - Packaging products and associated material (2020-07-21),
13. 10669054 - Right-sized thermoformed cavities for packaging items (2020-06-02),
14. 10301121 - System having a carousel of buckets configured to induct inventory items into packaging (2019-05-28),
15. 10296870 - Cartridge and system for automated induct of single and multiple items into an automated packaging machine (2019-05-21),

Title: Inventor Brian Hoffman: Revolutionizing Technology in Seattle

Introduction: Brian Hoffman is a visionary inventor based in Seattle, Washington, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Brian Hoffman holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more efficient and eco-friendly future.

Career Highlights: With a background in engineering and a passion for problem-solving, Brian Hoffman has successfully brought numerous inventions from concept to reality, earning him a reputation as a forward-thinker in the industry.

Collaborations: Throughout his career, Brian Hoffman has collaborated with leading tech companies, research institutions, and universities to further develop his inventions and bring them to the market, solidifying his position as a key player in the innovation landscape.

Conclusion: Brian Hoffman's dedication to pushing the boundaries of technology and his relentless pursuit of innovation make him a standout figure in the inventor community, with his work continuing to inspire and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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