Highland Village, TX, United States of America

Brian H Bunnett

This inventor holds 1 USPTO granted patent and 3 published patent applications and 1 EPO patent. Top assignee: Arctic Express Packs LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian H Bunnett. Retrieved from https://idiyas.com/inventor/brian-h-bunnett

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Brian H. Bunnett: Inventor of an On-Demand Cold Pack System

Introduction

Brian H. Bunnett is an inventor based in Highland Village, Texas. His work includes a patent for a system that produces cold packs by adding refrigerant fluid to a pack containing super absorbent material.

Latest Patents

Bunnett’s listed patent, “Cold Packs System,” describes a waterproof pack containing super absorbent material (SAM) without refrigerant fluid. A filling unit adds refrigerant fluid to the pack, creating a refrigerant pack. The patent also describes apparatus that combines SAM and refrigerant fluid in a bag and cools the resulting pack to produce a cold pack. Related apparatus and methods are included in the invention. Bunnett has 1 patent listed in the information provided.

Career Highlights

Bunnett is associated with Arctic Express Packs LLC. His patented system focuses on producing cold packs through a process that adds refrigerant fluid to SAM packs and cools them.

Collaborations

Bunnett’s listed coworker is Shlomo Nevo. The available information does not specify further details about their collaboration.

Conclusion

Brian H. Bunnett’s cold-pack invention describes an approach to preparing and cooling SAM-based packs, and his work is associated with Arctic Express Packs LLC.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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