Arden, NC, United States of America

Brian Gene Ruppel


 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: The Innovations of Brian Gene Ruppel

Introduction

Brian Gene Ruppel is an accomplished inventor based in Arden, North Carolina. He has made significant contributions to the field of materials science, particularly in the development of glass compositions suitable for electronic applications. His innovative work has led to the creation of a unique patent that addresses the need for low dielectric materials.

Latest Patents

Ruppel holds a patent for a "Low dielectric glass composition, fibers, and article." This invention focuses on glass compositions and glass fibers that exhibit low dielectric constants and low dissipation factors. These properties make them ideal for use in various electronic applications. The specific composition includes a range of materials, such as SiO, BO, AlO, PO, CaO, MgO, FeO, and TiO, with precise weight percentages that optimize performance. The glass composition also boasts a viscosity of 1000 poise at temperatures exceeding 1350 degrees Celsius.

Career Highlights

Brian Gene Ruppel is currently associated with Agy Holding Corporation, where he continues to innovate and develop advanced materials. His work has not only contributed to the company's portfolio but has also advanced the field of electronic materials significantly.

Collaborations

Ruppel has collaborated with notable colleagues, including Robert Lurie Hausrath and Anthony V Longobardo. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise, further enhancing the quality of their innovations.

Conclusion

Brian Gene Ruppel's contributions to the field of materials science, particularly through his patented low dielectric glass compositions, highlight his role as a significant inventor. His work continues to influence the development of materials for electronic applications, showcasing the importance of innovation in technology.

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