Brian G Baxter

Title: Brian G Baxter - Innovator in Semiconductor Technology

Introduction

Brian G Baxter is a notable inventor based in Hastings, NY (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods for cleaving semiconductor wafers.

Latest Patents

Brian G Baxter holds 1 patent for his invention titled "Method and apparatus for cleaving a semiconductor wafer into individual die." This invention discloses a novel method and apparatus for cleaving semiconductor wafers into individual die. The process involves mounting the wafer upon an adherent resilient air impermeable membrane while the latter is flat. Cleaving is achieved by using air pressure to inflate the membrane, which causes bending and tensile stresses on the wafer due to its adhesion to the inflating membrane. These stresses cleave the wafer along the scribe marks to form individual die. The die can be easily removed by applying a vacuum to the underside of the membrane, which draws it against a perforated undulatory grid dimensioned according to the die dimensions. This reduces surface contact and adhesion of the die to the membrane, facilitating a low-stress pick-off of the die.

Career Highlights

Brian G Baxter is currently employed at General Electric Company, where he continues to innovate and contribute to advancements in semiconductor technology. His work has had a significant impact on the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Throughout his career, Brian has collaborated with notable colleagues, including Walter Fabian and Albert J Manoni. These collaborations have further enhanced his contributions to the field.

Conclusion

Brian G Baxter is a distinguished inventor whose work in semiconductor technology has led to innovative solutions for wafer cleaving. His contributions continue to influence the industry and pave the way for future advancements.