Brian Edelbach

Title: Brian Edelbach: Innovator in Chemical Mechanical Polishing Slurries

Introduction

Brian Edelbach is a notable inventor based in Lima, NY (US). He has made significant contributions to the field of chemical mechanical polishing, particularly with his innovative slurry formulations. His work is essential for enhancing the efficiency and selectivity of polishing processes in various applications.

Latest Patents

Edelbach holds a patent for a "High selectivity CMP slurry." This invention provides a chemical mechanical polishing slurry designed to preferentially remove a first substance from a surface while minimizing the impact on silicon nitride. The slurry comprises an abrasive, an aqueous medium, and an organic polyol that does not dissociate protons. The preferred embodiment utilizes ceria particles as the abrasive, with the organic polyol selected from a group that includes mannitol, sorbitol, and sucrose. This innovative slurry can also include acids or bases to adjust the pH, making it versatile for various polishing needs.

Career Highlights

Brian Edelbach is currently associated with Ferro Corporation, where he continues to develop and refine his innovative products. His work has been instrumental in advancing the technology used in chemical mechanical polishing, which is critical in semiconductor manufacturing and other high-tech industries.

Collaborations

Edelbach has collaborated with notable colleagues such as Eric Oswald and Yie-Shein Her. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas, further enhancing the development of effective polishing solutions.

Conclusion

Brian Edelbach's contributions to the field of chemical mechanical polishing are significant and impactful. His innovative slurry formulations and collaborative efforts continue to advance the industry, making him a key figure in the realm of inventions related to polishing technologies.