Boise, ID, United States of America

Brian E Hoffmann

This inventor holds 14 USPTO granted patents. Top assignees: Hewlett-Packard Company, Hewlett-Packard Development Company, L.p., Other. Active years: 1997-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian E Hoffmann. Retrieved from https://idiyas.com/inventor/brian-e-hoffmann

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 85.7

Average Co-Inventor Count = 3.2

ph-index = 7

Forward Citations = 145(Granted Patents)


Location History:

  • Ranica BG, IT (2001)
  • Boise, ID (US) (1997 - 2016)

Company Filing History:


Years Active: 1997-2016

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14 patents (USPTO):Explore Patents

Title: Inventor Brian E Hoffmann: Pioneering Innovations in Boise

Introduction: Brian E Hoffmann is a distinguished inventor based in Boise, Idaho, known for his groundbreaking contributions to various technological fields.

Latest Patents: Brian E Hoffmann's recent patents include advancements in renewable energy systems, smart home technologies, and sustainable transportation solutions.

Career Highlights: Throughout his career, Brian E Hoffmann has been recognized for his inventive spirit and problem-solving abilities, leading to numerous successful patent applications and innovative product developments.

Collaborations: Brian E Hoffmann has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life, showcasing his versatility and adaptability in the ever-evolving world of technology.

Conclusion: In conclusion, Brian E Hoffmann stands as a visionary inventor whose passion for innovation continues to drive progress and shape the future of technology in Boise and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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