Red Hook, NY, United States of America

Brian E Hanrahan


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018-2020

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3 patents (USPTO):

Title: Spotlight on Inventor Brian E Hanrahan

Introduction:

Meet Brian E Hanrahan, a brilliant inventor based in Red Hook, NY, with a remarkable knack for innovation in the field of module installation. Hanrahan has made significant contributions, holding a total of three patents and showcasing a talent for developing cutting-edge solutions.

Latest Patents:

1. Method of Mounting a Module to a Land Grid Array (LGA): This patent introduces a unique method for mounting a module to a land grid array, involving the use of a specialized tool with alignment features. By aligning the module with the socket during installation, Hanrahan's invention ensures precise connections and efficient assembly processes.

2. Module Installation Alignment Device: Hanrahan's second patent focuses on a module installation assembly designed to facilitate the installation of modules into sockets of a land grid array. The tool's mounting bracket and alignment member work in tandem to guide the module through the cavity, enabling seamless integration with the socket.

Career Highlights:

Currently employed at International Business Machines Corporation (IBM), Hanrahan continues to push the boundaries of technological advancements within the industry. His innovative spirit and dedication to creating inventive solutions have positioned him as a key player in the field of module installation technology.

Collaborations:

Hanrahan collaborates with talented individuals within the industry, including Enrico A Romano and Yuet-Ying Yu. Together, they have worked on projects that have further advanced the field of module installation and contributed to the success of their team.

Conclusion:

Inventor Brian E Hanrahan's inventive prowess and commitment to excellence shine through his impressive body of work. With a focus on enhancing module installation processes, he has established himself as a trailblazer in the innovation landscape. We look forward to witnessing his future contributions to the world of technology and beyond.

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