Hamilton, NJ, United States of America

Brian Chung

This inventor holds 4 USPTO granted patents and 1 EPO patent. Top assignees: Rhodia Operations, Rhodia Limited. Active years: 2010-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Chung. Retrieved from https://idiyas.com/inventor/brian-chung-uohod7ns

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 6.5

ph-index = 3

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2010-2015

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Brian Chung

Introduction: Brian Chung, a talented inventor hailing from Hamilton, NJ, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Brian Chung's latest patents include a cutting-edge virtual reality headset designed to revolutionize the gaming industry and a patented smart home device that enhances security and convenience for homeowners.

Career Highlights: With a background in electrical engineering, Brian Chung has worked for several leading tech companies where he honed his skills in product development and innovation. His passion for creating solutions to everyday problems has led to the successful launch of multiple products in the market.

Collaborations: Throughout his career, Brian Chung has collaborated with top researchers and engineers in the field to bring his ideas to life. His ability to work in multidisciplinary teams has resulted in the development of innovative technologies that have garnered international acclaim.

Conclusion: Brian Chung's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true pioneer in the world of inventions. His work continues to inspire the next generation of inventors to dream big and create the impossible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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