This inventor holds 4 USPTO granted patents. Top assignee: Weyerhaeuser Company Limited. Active years: 2001-2008.
Company Filing History:
Years Active: 2001-2008
Title: Innovations by Brian C. Horsfield
Introduction
Brian C. Horsfield is a notable inventor based in Federal Way, WA (US). He holds a total of 4 patents that showcase his contributions to the field of encapsulation technology. His work primarily focuses on methods for encapsulating cellulose-based substrates, which have significant applications in various industries.
Latest Patents
Horsfield's latest patents include innovative processes for encapsulating cellulose-based substrates using different heating methods. The first patent, titled "Process for encapsulation of cellulose based substrates using electromagnetic radiation heating," describes a method that involves raising the temperature of polymeric films with an electromagnetic radiation source. This process creates a pressure differential that promotes the conformance of the films to the cellulose-based substrates, ensuring complete encapsulation. The films are sealed around the edges of the substrate, including areas defined by slots and cutouts.
The second patent, "Process for encapsulation of cellulose based substrate using non-electromagnetic heating," outlines a similar method but utilizes a non-electromagnetic radiation heating source. This approach also provides a pressure differential to enhance the conformance of the films to the cellulose-based substrate, resulting in complete encapsulation and sealing around the peripheral edges and adjacent slots.
Career Highlights
Brian C. Horsfield is associated with Weyerhaeuser Company Limited, where he applies his expertise in encapsulation technology. His innovative approaches have contributed to advancements in the field, particularly in the use of cellulose-based materials.
Collaborations
Horsfield has collaborated with notable colleagues, including Gerald A. Ziegler and Gerald Wilhite, who have also made significant contributions to their respective fields.
Conclusion
Brian C. Horsfield's work in encapsulation technology demonstrates his commitment to innovation and advancement in material science. His patents reflect a deep understanding of the processes involved in encapsulating cellulose-based substrates, which can lead to new applications and improvements in various industries.