Company Filing History:
Years Active: 2002-2009
Title: Brian A. Scott: Innovator in Thermal Management Technologies
Introduction
Brian A. Scott is a notable inventor based in El Dorado Hills, CA (US). He has made significant contributions to the field of thermal management technologies, holding a total of 3 patents. His work primarily focuses on innovative solutions that enhance the efficiency of heat dissipation in electronic devices.
Latest Patents
One of Brian's latest patents is for a "Heat sink with thermoelectric module." This apparatus includes a thermally-conductive heat sink core with a solid-state heat pump, designed to improve thermal management in various applications. Another significant patent is the "Integrated circuit refrigeration device," which features a heat pipe with a flow diverter that separates the system into evaporator and condenser chambers. This design allows for efficient heat removal from integrated circuits, utilizing an acoustic compressor to enhance the refrigeration cycle.
Career Highlights
Brian A. Scott is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies in thermal management. His work at Intel has positioned him as a key player in the advancement of efficient cooling solutions for electronic devices.
Collaborations
Throughout his career, Brian has collaborated with esteemed colleagues such as George H. Daskalakis and Paul J. Gwin. These partnerships have fostered innovation and contributed to the successful development of his patented technologies.
Conclusion
Brian A. Scott's contributions to thermal management technologies reflect his dedication to innovation and efficiency. His patents demonstrate a commitment to enhancing the performance of electronic devices through effective heat dissipation solutions.