Brian A Cohen

Title: Brian A Cohen: Innovator in Interconnect Structures

Introduction

Brian A Cohen is a notable inventor based in Beacon, NY (US). He has made significant contributions to the field of interconnect structures, holding a total of 3 patents. His work focuses on innovative methods that enhance the manufacturing processes in electronics.

Latest Patents

One of Brian's latest patents is titled "Self-aligned via interconnect structures." This patent discloses methods of manufacturing self-aligned via interconnect structures. The method includes forming a wiring structure in a dielectric material, followed by the formation of a cap layer over the surface of the wiring structure and the dielectric material. An opening is created in the cap layer to expose a portion of the wiring structure. The process then involves selectively growing a metal or metal-alloy via interconnect structure material on the exposed portion of the wiring structure through the opening in the cap layer. Finally, an upper wiring structure is formed in electrical contact with the metal or metal-alloy via interconnect structure.

Career Highlights

Throughout his career, Brian has worked with prominent companies, including IBM and Peer Bearing Company. His experience in these organizations has contributed to his expertise in the field of interconnect structures and manufacturing processes.

Collaborations

Brian has collaborated with several talented individuals, including Benjamin C Backes and Joyeeta Nag. These collaborations have likely enriched his work and contributed to the development of innovative solutions in his field.

Conclusion

Brian A Cohen is a distinguished inventor whose work in self-aligned via interconnect structures has made a significant impact in the electronics industry. His patents and collaborations reflect his commitment to innovation and excellence in manufacturing processes.