This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1996.
Company Filing History:
Years Active: 1996
Title: **Innovative Contributions of Brain S Beaman in Electronic Device Packaging**
Introduction
Brain S Beaman, an inventive mind located in Hyde Park, NY, has made significant contributions to the field of electronic devices. With a focus on enhancing the capabilities of semiconductor packaging, Beaman holds a notable patent that addresses the complexities of three-dimensional electronic structures.
Latest Patents
Beaman's sole patent, titled "Method of forming a three dimensional high performance interconnection," presents a groundbreaking approach to packaging electronic devices. This invention allows for the efficient propagation of electrical signals both horizontally and vertically. The method involves creating a structure from multiple assemblies, each containing substrates equipped with electronic devices. These assemblies are stacked and interconnected using an elastomeric interposer, which features a series of electrical conductors arranged within polymer material. The design not only accommodates the positioning of electronic devices but also incorporates thermal conductivity, potentially utilizing materials like diamond for optimal heat dissipation.
Career Highlights
Throughout his career, Brain S Beaman has been associated with the distinguished International Business Machines Corporation (IBM). His innovative work in the field of semiconductor packaging has led to advancements that can significantly impact the efficiency and performance of electronic devices.
Collaborations
In his endeavors, Beaman has collaborated with distinguished colleagues such as Fuad Elias Doany and Keith E Fogel. Together, they have contributed to the advancement of technology within their field, fostering innovation through teamwork and shared expertise.
Conclusion
Brain S Beaman's contributions to electronic device packaging are noteworthy, particularly his patented method that proposes solutions for three-dimensional assembly configurations. His work at IBM and collaborations with other esteemed professionals underline the importance of innovation in the technology sector, showcasing how inventive minds continue to shape the future of electronics.