This inventor holds 2 USPTO granted patents. Top assignee: Pace, Incorporated. Active years: 1988-1989.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Norcross, GA (US) (1988)
- Baltimore, MD (US) (1989)
Company Filing History:
Years Active: 1988-1989
Title: Bradford W. Coffman: Innovator in Soldering Technology
Introduction
Bradford W. Coffman is a notable inventor based in Norcross, GA (US). He has made significant contributions to the field of soldering technology, holding 2 patents that showcase his innovative approach to enhancing electronic component assembly.
Latest Patents
Coffman's latest patents include a method of soldering with heated fluid and a device designed for delivering heated fluid to the sides of a component. This device effectively melts solder at terminals located at the periphery of the component. It features a nozzle that directs heated fluid in a specific manner to ensure optimal heat transfer, thus facilitating quick and convenient attachment or removal of components from printed circuit boards. Another patent involves an optical system that can be used independently or in conjunction with a device for attaching or removing modular electronic components. This system includes a horizontally rotatable microscope that allows for comprehensive viewing and alignment of component terminals with substrate leads.
Career Highlights
Coffman is associated with Pace, Incorporated, where he has applied his expertise in soldering technology. His work has significantly impacted the efficiency and effectiveness of electronic component assembly processes.
Collaborations
Some of his notable coworkers include William J. Siegel and Bobby L. Mason, who have likely contributed to the innovative environment at Pace, Incorporated.
Conclusion
Bradford W. Coffman's contributions to soldering technology through his patents reflect his commitment to innovation in the electronics field. His work continues to influence the efficiency of electronic component assembly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile