Omaha, NE, United States of America

Bradford E Schulz

This inventor holds 1 USPTO granted patent, plus 1 CIPO patent. Top assignee: Delkor Systems, Inc.. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bradford E Schulz. Retrieved from https://idiyas.com/inventor/bradford-e-schulz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Bradford E. Schulz: Innovator in Shipping Solutions

Introduction

Bradford E. Schulz is a notable inventor based in Omaha, NE (US). He has made significant contributions to the field of packaging and shipping through his innovative designs. His work focuses on creating efficient and effective solutions for container assembly.

Latest Patents

Schulz holds a patent for an innovative shipping package. This container package assembly comprises a first support member and a second support member, a plurality of containers, a top pad, and a membrane. The design allows for a predetermined number of containers to be securely held, ensuring safe transport. The assembly is at least partially encapsulated by the membrane, providing additional protection during shipping.

Career Highlights

Bradford E. Schulz is associated with Delkor Systems, Inc., where he applies his expertise in packaging solutions. His innovative approach has led to advancements in shipping efficiency and safety. With a focus on practical applications, Schulz continues to influence the industry positively.

Collaborations

Some of his notable coworkers include Dale C. Andersen and Peter Nelson Fox. Their collaborative efforts contribute to the development of cutting-edge packaging technologies.

Conclusion

Bradford E. Schulz exemplifies innovation in the shipping industry through his patented designs and collaborative work. His contributions continue to shape the future of packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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