Brad Banister

Title: Brad Banister: Innovator in High-Density Interconnect Technology

Introduction

Brad Banister is a notable inventor based in Orange, California. He has made significant contributions to the field of high-density interconnect (HDI) technology. With a total of 3 patents to his name, Banister has developed innovative methods that enhance the efficiency and effectiveness of interconnect systems.

Latest Patents

Banister's latest patents include a method of making a multi-layer interconnect and a bond-ply structure for interconnection of circuit layer pairs with conductive inks. The first patent focuses on processes that test panels to identify good cells, allowing for the creation of new panels made entirely of known good cells. This innovation increases the number of layers used in HDI without the typical decrease in yield associated with layering processes. The second patent introduces a unique bond-ply structure that compensates for shrinkage during sintering, creating a stress-free and void-free electrically conductive junction between layer pairs in an interconnect.

Career Highlights

Throughout his career, Banister has worked with prominent companies such as Honeywell International Inc. and AlliedSignal Inc. His experience in these organizations has contributed to his expertise in the field of interconnect technology.

Collaborations

Banister has collaborated with notable professionals in the industry, including Richard J. Pommer and Simon McElrea. These collaborations have further enriched his work and innovations.

Conclusion

Brad Banister is a distinguished inventor whose work in high-density interconnect technology has made a significant impact. His innovative patents and career achievements reflect his dedication to advancing the field.