Beijing, China

Boyuan Sun

This inventor holds 1 USPTO granted patent. Top assignee: Apple Inc.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Boyuan Sun. Retrieved from https://idiyas.com/inventor/boyuan-sun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Boyuan Sun - Innovator in 3D Measurement Technologies

Introduction

Boyuan Sun is a notable inventor based in Beijing, China. He has made significant contributions to the field of measurement technologies, particularly through his innovative patent related to three-dimensional representations of physical environments.

Latest Patents

Boyuan Sun holds a patent for "Scan-based measurements." This invention includes various implementations that generate floorplans and measurements using a three-dimensional (3D) representation of a physical environment, which is created based on sensor data. This technology has the potential to revolutionize how spatial data is captured and utilized.

Career Highlights

Boyuan Sun is currently employed at Apple Inc., where he continues to develop cutting-edge technologies. His work focuses on enhancing the accuracy and efficiency of measurement systems, contributing to the company's reputation for innovation.

Collaborations

He has collaborated with notable colleagues, including Yang Yang and Afshin Dehghan, who share a commitment to advancing technology in their respective fields.

Conclusion

Boyuan Sun's contributions to 3D measurement technologies exemplify the spirit of innovation. His work at Apple Inc. and his patent for scan-based measurements highlight his role as a leading inventor in this domain.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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