Shanghai, China

Boyu Cui

This inventor holds 7 USPTO granted patents. Top assignees: Cloudminds Robotics Co., Ltd., Chongqing Xingjie Shuxing Technology Partnership Enterprise (Limited Partnership). Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Boyu Cui. Retrieved from https://idiyas.com/inventor/boyu-cui-unafetfk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 85.7

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2023-2026

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7 patents (USPTO):Explore Patents

Title: Boyu Cui - Innovator in Connection Technology

Introduction

Boyu Cui is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of connection technology, holding a total of 7 patents. His work focuses on developing innovative components that enhance electrical connectivity.

Latest Patents

Among his latest patents are a connection component, a connector, a patch cord, and a connector inner shell. The connection component is designed to achieve electric connection and includes two connectors. These connectors feature identical butt-joint structures that allow them to connect securely. The locking mechanisms within the connectors ensure that they remain locked in place during use, while also allowing for easy separation when needed.

Career Highlights

Boyu Cui has worked with notable companies such as Cloudminds Robotics Co., Ltd. and Chongqing Xingjie Shuxing Technology Partnership Enterprise. His experience in these organizations has contributed to his expertise in the development of advanced connection technologies.

Collaborations

Throughout his career, Boyu Cui has collaborated with talented individuals, including Wenshan Deng and Cheng Luo. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Boyu Cui is a dedicated inventor whose work in connection technology continues to impact the industry. His innovative patents and collaborations highlight his commitment to advancing electrical connectivity solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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