This inventor holds 5 USPTO granted patents, plus 3 CIPO patents. Top assignee: Atd Corporation. Active years: 1995-2000.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1995-2000
Title: Innovations by Boyd A. Barnard
Introduction
Boyd A. Barnard is a notable inventor based in St. Louis, MO (US). He has made significant contributions to the field of materials science, particularly in the development of advanced laminates. With a total of 5 patents to his name, Barnard's work showcases his innovative approach to solving complex engineering challenges.
Latest Patents
Among his latest inventions is a pressure-sensitive adhesive laminate. This invention relates to improved polymer-pressure sensitive adhesive combinations, particularly in the form of laminates, and methods of producing the same. It enhances the bond strength of the pressure-sensitive adhesive to the polymer layer by priming the polymer surface with a curable urethane primer before applying the adhesive. If the polymer surface is not 'active' to the curable urethane primer, it is first activated with a silicon-containing treating agent. The laminates developed through this invention exhibit superior bond strength, especially in long-term applications. Notably, the polymer can be a silicone foam, while the pressure-sensitive adhesive may be either acrylic or silicone-based.
Another significant patent is for a heat barrier laminate. This lightweight and resilient laminate provides sound and vibration dampening. It has a density of less than about 5 lb/ft³ and a total thickness of no greater than about 1 inch. The laminate consists of a first metal foil with high heat conductivity and a first batt of insulating nonwoven fiber material. The first batt serves as the outermost layer, adhesively bonded to one side of the metal foil. Additionally, it includes a second metal foil and a second batt of insulating nonwoven fiber material, which is thicker than the first batt. This innovative design allows for effective heat management and sound dampening.
Career Highlights
Boyd A. Barnard is currently associated with Atd Corporation, where he continues to push the boundaries of material innovation. His work has not only advanced the field but has also contributed to various applications in industries requiring high-performance materials.
Collaborations
Throughout his career, Barnard has collaborated with notable colleagues, including G. William Ragland and William M. Sheridan. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Boyd A. Barnard's contributions to the field of materials science through his
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile