Hong Kong, China

Borislav Popov

This inventor holds 2 USPTO granted patents. Top assignee: One World Technologies, Inc.. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Borislav Popov. Retrieved from https://idiyas.com/inventor/borislav-popov-93wi36x6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 63(Granted Patents)


Company Filing History:


Years Active: 2006

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2 patents (USPTO):Explore Patents

Title: Borislav Popov: Innovator in Power Tools

Introduction

Borislav Popov is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of power tools, holding 2 patents to his name. His work has been instrumental in advancing the functionality and efficiency of various tools used in construction and home improvement.

Latest Patents

Among his latest innovations are the reciprocating saw and a heat gun. These inventions showcase his ability to enhance existing technologies and provide users with more effective tools for their projects.

Career Highlights

Borislav Popov is currently employed at One World Technologies, Inc. His role at the company allows him to apply his inventive skills and contribute to the development of cutting-edge power tools. His work has garnered attention in the industry, reflecting his commitment to innovation.

Collaborations

Throughout his career, Borislav has collaborated with talented individuals such as Taku Ohi and Kenneth M Brazell. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of new technologies.

Conclusion

Borislav Popov is a distinguished inventor whose contributions to power tools have made a lasting impact. His innovative spirit and collaborative efforts continue to drive advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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