Herzogenaurach, Germany

Boon Siew Han

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Nanyang Technological University. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Boon Siew Han. Retrieved from https://idiyas.com/inventor/boon-siew-han-vxygyf3t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Boon Siew Han and RFID Antenna Innovation.

Introduction

Boon Siew Han is an inventor associated with Nanyang Technological University. His work includes a patented radio-frequency identification antenna designed for use on metallic objects.

Latest Patents

The supplied information lists one patent for Boon Siew Han: “Dual-band radio frequency identification tag antenna for metallic objects.” The invention describes an RFID tag antenna mounted on a metallic object. It uses a dielectric substrate, a conductive layer attached to the object, an integrated circuit, and an antenna structure designed to resonate in two frequency bands. A loop feed electromagnetically couples the antenna to the integrated circuit, while two via pins connect points on the antenna structure to corresponding points on the conductive layer. The listed patent count is 1 patent.

Career Highlights

Boon Siew Han is associated with Nanyang Technological University, where his work is connected to RFID antenna technology. The patent’s design addresses the challenge of enabling RFID tags to operate when mounted on metallic surfaces.

Collaborations

The supplied information identifies Rui Xu and Zhongxiang Shen as Boon Siew Han’s coworkers.

Conclusion

Boon Siew Han’s listed patent presents a dual-band RFID antenna design intended for metallic objects, combining a specialized antenna structure, loop feed, and conductive-layer connections.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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