Company Filing History:
Years Active: 2007
Title: Boon Seng Tan: Innovator in Electronic Packaging Solutions
Introduction
Boon Seng Tan is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on innovative solutions that enhance the reliability and functionality of electronic devices.
Latest Patents
Boon Seng Tan's latest patents include the "IC package pressure release apparatus and method." This invention provides an effective way to release pressure within a package that comprises a substrate with an attached die, facilitating electrical connections between the die and the package's exterior. The design features a lid and sealant arranged in a specific pattern with at least one break, allowing for efficient pressure management. Another significant patent is the "Windowed package for electronic circuitry," which shares similar principles in addressing pressure release within electronic packages.
Career Highlights
Boon Seng Tan is currently employed at Intel Corporation, a leading company in technology and innovation. His role at Intel allows him to work on cutting-edge projects that push the boundaries of electronic packaging technology. His contributions have been instrumental in advancing the company's product offerings.
Collaborations
Boon Seng Tan collaborates with talented individuals such as Sudipto Neogi and Biswajit Sur. These partnerships foster a creative environment that encourages innovation and the development of new technologies.
Conclusion
Boon Seng Tan's work exemplifies the spirit of innovation in the field of electronic packaging. His patents not only address critical challenges but also pave the way for future advancements in technology.