Boon Meng Chan

Title: Innovations by Boon Meng Chan in Injection Molding Technology.

Introduction

Boon Meng Chan is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of injection molding, particularly in the manufacturing of semiconductor elements. With a total of two patents to his name, Chan's work showcases innovative methods and apparatuses that enhance the efficiency and effectiveness of injection molding processes.

Latest Patents

Boon Meng Chan's latest patents include a "Method of Injection Molding Elements Such as Semiconductor Elements" and an "Apparatus for the Injection Molding of Semiconductor Elements." The method patent outlines a multi-step process for charging a molding compound into an injection nozzle and injecting it into a mold cavity. This process ensures that the molding compound is cured at the right time, allowing for efficient production. The apparatus patent describes a specialized injection molding apparatus that connects directly to a mold, facilitating rapid curing and effective separation of the mold and nozzle during the manufacturing process.

Career Highlights

Throughout his career, Boon Meng Chan has worked with reputable companies such as General Instrument Corporation of Delaware and Kras Asia Ltd. His experience in these organizations has contributed to his expertise in the field of injection molding technology.

Collaborations

Boon Meng Chan has collaborated with notable individuals in his field, including Eugene Chen and Hohn Jong Hsiung. These collaborations have likely enriched his work and contributed to the development of his innovative patents.

Conclusion

Boon Meng Chan's contributions to injection molding technology reflect his dedication to innovation and efficiency in manufacturing processes. His patents not only advance the field but also demonstrate the potential for further developments in semiconductor manufacturing.