Suwon, South Korea

Boo Min Noh

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Boo Min Noh. Retrieved from https://idiyas.com/inventor/boo-min-noh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Boo Min Noh: Inventor of a Moisture-Resistant Multilayer Electronic Component.

Introduction

Boo Min Noh is an inventor based in Suwon, South Korea, and is associated with Samsung Electro-Mechanics Co., Ltd. His patent work addresses the reliability of multilayer electronic components, particularly their resistance to moisture.

Latest Patents

The provided information lists 1 patent for Noh: “Multilayer Electronic Component Having Improved Moisture Resistance Reliability.” The invention describes a component with a body made of dielectric layers and internal electrodes arranged in alternating layers. Its external electrodes include a copper lower layer in contact with the internal electrodes, a silver upper layer, and a copper-silver alloy layer at the interface between them. A copper-oxide region on at least part of the lower layer’s external surface is intended to improve moisture-resistance reliability.

Career Highlights

Noh’s listed patent reflects work on the materials and layered structure of electronic components. The disclosed design focuses on the interface between electrode layers and the oxidation of the copper layer as features relevant to moisture resistance.

Collaborations

The provided information names Jin Sung Lee and Young Bin Jeong as Noh’s coworkers. It does not specify their roles in the patent or establish that they are co-inventors.

Conclusion

Boo Min Noh’s listed invention concerns a multilayer electronic component designed to improve moisture-resistance reliability through its electrode materials and layered structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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