Bonnie Ming-Yan Chan

Title: Bonnie Ming-Yan Chan: Innovator in Semiconductor Packaging

Introduction

Bonnie Ming-Yan Chan is a prominent inventor based in Sunnyvale, CA. She has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. Her work focuses on innovative methods that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

One of her latest patents is titled "Etched surface mount islands in a leadframe package." This patent discloses a method of fabricating a leadframe-based semiconductor package. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is designed with a plurality of electrical terminals that are surface mounted to a host PCB. Additionally, the leadframe features one or more extended leads, at least one of which includes an electrically conductive island. This island is surface mounted to the host PCB alongside the electrical terminals. The innovative design of these islands effectively increases the number of terminals within the package without adding footprint to the package.

Career Highlights

Bonnie is currently employed at Sandisk Technologies Inc., where she continues to push the boundaries of semiconductor technology. Her expertise in leadframe-based packages has positioned her as a key player in the industry.

Collaborations

Throughout her career, Bonnie has collaborated with notable colleagues, including Suresh Kumar Upadhyayula and Shih-Ping Fan-chiang. These collaborations have further enriched her work and contributed to advancements in semiconductor packaging.

Conclusion

Bonnie Ming-Yan Chan is a trailblazer in the semiconductor industry, with her innovative patents and contributions shaping the future of technology. Her work exemplifies the importance of creativity and collaboration in driving advancements in semiconductor packaging.