The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Aug. 29, 2011
Suresh Upadhyayula, San Jose, CA (US);
Bonnie Ming-yan Chan, Sunnyvale, CA (US);
Shih-ping Fan-chiang, Taichung, TW;
Hem Takiar, Fremont, CA (US);
Suresh Upadhyayula, San Jose, CA (US);
Bonnie Ming-Yan Chan, Sunnyvale, CA (US);
Shih-Ping Fan-chiang, Taichung, TW;
Hem Takiar, Fremont, CA (US);
SanDisk Technologies Inc., Plano, TX (US);
Abstract
A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.