Bon-ki Ku

Title: Bon-ki Ku: Innovator in Semiconductor Technology

Introduction

Bon-ki Ku is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative gap-fill methods. His work is essential for advancing the manufacturing processes of semiconductor devices.

Latest Patents

Bon-ki Ku holds a patent for gap-fill methods that are crucial in the semiconductor industry. The patent outlines a process that includes providing a semiconductor substrate with a relief image containing gaps of 50 nm or less. The method involves applying a gap-fill composition that consists of a first polymer with a crosslinkable group and a second polymer with a chromophore. The process further includes heating the composition to form a crosslinked polymer, followed by the formation of a photoresist layer and patternwise exposure to radiation. This innovative approach is particularly useful for filling high aspect ratio gaps with an antireflective coating material.

Career Highlights

Throughout his career, Bon-ki Ku has worked with prominent companies in the semiconductor sector. He has been associated with Rohm and Haas Electronic Materials LLC and Rohm and Haas Electronic Materials Korea Ltd. His experience in these organizations has contributed to his expertise in semiconductor manufacturing processes.

Collaborations

Bon-ki Ku has collaborated with notable professionals in his field, including Jae Hwan Sim and Jae-Bong Lim. These collaborations have likely enhanced his research and development efforts in semiconductor technologies.

Conclusion

Bon-ki Ku is a distinguished inventor whose work in gap-fill methods has made a significant impact on semiconductor manufacturing. His innovative approaches continue to influence the industry and pave the way for future advancements.