Nanning, China

Bolin Dai

This inventor holds 1 USPTO granted patent. Top assignee: Guangxi University. Active years: 2026.


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Bolin Dai - Innovator in Chipless RFID Technology

Introduction

Bolin Dai is a prominent inventor based in Nanning, China. He has made significant contributions to the field of radio frequency identification (RFID) technology. His innovative work focuses on developing advanced solutions that enhance the efficiency and functionality of RFID systems.

Latest Patents

Bolin Dai holds a patent for a "Frequency domain-based printable chipless radio frequency identification (RFID) tag of quadrilateral open resonator." This invention provides a frequency domain-based printable chipless RFID tag that utilizes a quadrilateral open resonator. The design includes a rectangular dielectric substrate with a metal grounding layer at the bottom. Above this substrate, four groups of quadrilateral open resonance units and two parallel symmetrical antennae are strategically placed. This configuration allows for convenient data encoding, high encoding density, and miniaturization of the RFID tag.

Career Highlights

Bolin Dai is affiliated with Guangxi University, where he continues to advance his research and development in RFID technology. His work has garnered attention for its innovative approach and practical applications in various industries.

Collaborations

Bolin Dai collaborates with notable colleagues, including Jianxin Deng and Shenglin Deng. Their combined expertise contributes to the advancement of RFID technology and its applications.

Conclusion

Bolin Dai's contributions to the field of RFID technology exemplify the spirit of innovation. His work not only enhances the capabilities of RFID systems but also paves the way for future advancements in the industry.

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