Hwaseong-si, South Korea

Boeun Jang

This inventor holds 1 USPTO granted patent. Top assignees: New Power Plasma., Ltd., Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Boeun Jang. Retrieved from https://idiyas.com/inventor/boeun-jang-64bfjyyx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Boeun Jang and Plasma Surface Treatment Innovation.

Introduction

Boeun Jang is an inventor associated with Hwaseong-si, South Korea. His work includes an invention designed to support plasma surface treatment of semiconductor package structures while helping protect delicate components.

Latest Patents

Jang is associated with 1 patent: “Apparatus for Conducting Plasma Surface Treatment, Board Treatment System Having the Same, and Method of Manufacturing Semiconductor Devices Using the Same.”

The invention describes a surface-treatment apparatus with a process chamber and an external plasma generator connected by a supply duct. A heat exchanger cools the process radicals as they pass through the duct, while a flow controller directs their movement and discharge. The system is intended to treat package structures with narrow mounting gaps while reducing the risk of damage to integrated-circuit chips and boards.

Career Highlights

Jang’s listed company affiliations include Samsung Electronics and New Power Plasma. His patent work concerns plasma processing equipment and semiconductor-device manufacturing.

Collaborations

Jang’s listed coworkers include Junyoung Oh and Jaeho Kwak.

Conclusion

Boeun Jang’s patent describes a plasma surface-treatment system intended to enable precise semiconductor package processing while protecting sensitive chips and boards.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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