Shenzhen, China

Bo Yi

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Huawei Cloud Computing Technologies Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bo Yi. Retrieved from https://idiyas.com/inventor/bo-yi-8rsg8vju

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Bo Yi - Innovator in Application Instance Deployment

Introduction

Bo Yi is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of cloud computing, particularly in application instance deployment methods. His innovative approach addresses the complexities of managing quality of service (QoS) requirements in cloud environments.

Latest Patents

Bo Yi holds a patent for an "Application instance deployment method, application instance scheduling method, and apparatus." This patent outlines a method where a global management platform receives QoS requirement information from a client. The platform then selects an available site that meets the specified delay requirements and deploys application instances accordingly. This method enhances the efficiency of resource allocation in cloud computing.

Career Highlights

Bo Yi is currently employed at Huawei Cloud Computing Technologies Co., Ltd. His work focuses on developing advanced technologies that improve cloud service delivery. His expertise in application deployment has positioned him as a key player in the industry.

Collaborations

Bo Yi collaborates with talented professionals such as Nannan Wang and Yang Xu. Together, they work on innovative projects that push the boundaries of cloud computing technology.

Conclusion

Bo Yi's contributions to application instance deployment methods reflect his commitment to advancing cloud computing technologies. His innovative solutions continue to shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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