Suzhou, China

Bo Wen

This inventor holds 1 USPTO granted patent. Top assignee: Realtek Semiconductor Inc.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bo Wen. Retrieved from https://idiyas.com/inventor/bo-wen-uuixmw70

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Bo Wen - Innovator in Bluetooth Technology

Introduction

Bo Wen is a notable inventor based in Suzhou, China. He has made significant contributions to the field of Bluetooth technology. His innovative approach has led to the development of a unique method for establishing Bluetooth connections.

Latest Patents

Bo Wen holds a patent for a Bluetooth connection establishing method. This method includes several steps, such as determining a new device connection period by a master device. The master device also identifies multiple connected devices and establishes a minimum device connection period. Furthermore, it selects a minimum time window corresponding to this period and determines anchor points for the connected devices. Finally, a maximum available time window is selected, and an available time spot is chosen as the new anchor point for the device to be connected.

Career Highlights

Bo Wen is currently employed at Realtek Semiconductor Inc., where he continues to innovate in the field of technology. His work has been instrumental in enhancing Bluetooth connectivity solutions.

Collaborations

He collaborates with talented coworkers, including Yu-Hsuan Liu and Wei-Feng Mao, who contribute to his projects and innovations.

Conclusion

Bo Wen's contributions to Bluetooth technology exemplify his dedication to innovation and advancement in the field. His patent reflects a significant step forward in improving device connectivity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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