Shenzhen, China

Bo-Wen He

This inventor holds 1 USPTO granted patent. Top assignee: Scienbizip Consulting(shenzhen)co., Ltd.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bo-Wen He. Retrieved from https://idiyas.com/inventor/bo-wen-he

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Bo-Wen He: Innovator in Mold Core Technology

Introduction

Bo-Wen He is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of mold core technology. His innovative approach has led to the development of a unique fixture that enhances the efficiency of mold core assembly.

Latest Patents

Bo-Wen He holds a patent for a "Fixture for mold cores." This invention includes a platform, a side plate mounted to the platform, a plurality of positioning tabs, and a pushing member. The positioning tabs are strategically located on the platform and abut the side plate, ensuring proper alignment. The pushing member is designed to retain the mold cores securely against the side plate. This invention simplifies the process of handling multiple mold cores, making it a valuable asset in manufacturing.

Career Highlights

He is currently employed at Scienbizip Consulting (Shenzhen) Co., Ltd. His work at this company has allowed him to focus on innovative solutions in the manufacturing sector. Bo-Wen He has demonstrated a commitment to advancing technology through his inventive spirit.

Collaborations

He collaborates with talented individuals such as Kun Chen and Zhi-Yong Tian. Their combined expertise fosters a creative environment that encourages innovation and problem-solving.

Conclusion

Bo-Wen He is a distinguished inventor whose work in mold core technology exemplifies the spirit of innovation. His contributions are paving the way for advancements in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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