Taejon, South Korea

Bo Sung Shin

This inventor holds 1 USPTO granted patent. Top assignee: Korea Advanced Institute of Science and Technology. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bo Sung Shin. Retrieved from https://idiyas.com/inventor/bo-sung-shin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 51(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Bo Sung Shin: Innovator in 3D Model Manufacturing

Introduction

Bo Sung Shin is a notable inventor based in Taejun, South Korea. He has made significant contributions to the field of 3D model manufacturing. His innovative approach focuses on enhancing the accuracy and efficiency of producing three-dimensional models.

Latest Patents

Bo Sung Shin holds a patent for a "Method for manufacturing a three-dimensional model by variable deposition and apparatus used therein." This patent aims to improve the accuracy of size and shape in manufacturing while reducing operational time. The method involves designing a 3D model, collecting shape data, slicing the model into layers, and depositing materials in accordance with the shape data. The process utilizes a computer-aided design and manufacturing system, which includes a variable deposition manufacturing apparatus.

Career Highlights

Bo Sung Shin is affiliated with the Korea Advanced Institute of Science and Technology. His work has been instrumental in advancing the techniques used in 3D model production. He has developed methods that streamline the manufacturing process and enhance the quality of the final products.

Collaborations

Some of his notable coworkers include Dong Yol Yang and Jun Ho Jeong. Their collaborative efforts have contributed to the success of various projects within the realm of 3D manufacturing.

Conclusion

Bo Sung Shin's innovative methods in 3D model manufacturing demonstrate his commitment to advancing technology in this field. His contributions are paving the way for more efficient and accurate manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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