Bo Sun

Title: Bo Sun: Innovator in Adhesive Technologies

Introduction

Bo Sun is a prominent inventor based in Bardonia, NY (US), known for his contributions to adhesive technologies. With a total of 5 patents, he has made significant advancements in the field, particularly in the development of hot melt adhesives suitable for electronic devices.

Latest Patents

One of Bo Sun's latest patents is a low bond-temperature hot melt adhesive with high impact strength and chemical resistance. This invention provides a hot melt adhesive that comprises polyester resins with a Tg below 0° C., frequently combined with polyester resins with a Tg above 50° C. It can be applied at 80° C. or lower, offering excellent impact resistance and broad chemical resistance. This hot melt adhesive is ideally suited for use in the manufacture of handheld and wearable electronic devices. Another notable patent is for a black sheet and black adhesive tape, which includes a laminate of a base sheet and an infrared reflecting layer. The CIE color values (L*, a*, b*) and the infrared reflectance R/[%] at a wavelength of 850 nm are within specific ranges, ensuring optimal performance.

Career Highlights

Throughout his career, Bo Sun has worked with notable organizations, including Sun Chemical Corporation and the University of Cincinnati. His work has focused on enhancing adhesive technologies, making significant contributions to the industry.

Collaborations

Bo Sun has collaborated with esteemed colleagues such as Jerome Moyer and Philippe Schottland, further enriching his innovative endeavors.

Conclusion

Bo Sun's work in adhesive technologies has led to significant advancements, particularly in applications for electronic devices. His innovative patents reflect his commitment to improving product performance and functionality.