Bo Luo

Title: Bo Luo: Innovator in SOI Devices for Plasma Display Technology

Introduction

Bo Luo is a prominent inventor based in Chengdu, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of SOI (Silicon-On-Insulator) devices for plasma display panel driver chips. His innovative work has garnered attention in the industry and has led to the filing of a patent.

Latest Patents

Bo Luo holds a patent for "SOI devices for plasma display panel driver chip." This invention includes a substrate, a buried oxide layer, and an n-type SOI layer arranged in a bottom-up order. The SOI layer is integrated with various devices, including HV-NMOS, HV-PMOS, Field-PMOS, LIGBT, CMOS, NPN, PNP, and HV-PNP devices. Notably, the SOI layer features an n+ doped region at the interface between the n-type SOI layer and the buried oxide layer, which has a higher doping concentration than the n-type SOI layer.

Career Highlights

Bo Luo is affiliated with the University of Electronic Science and Technology of China, where he continues to advance his research and development efforts. His work in the field of SOI devices has positioned him as a key figure in semiconductor innovation.

Collaborations

He collaborates with notable colleagues, including Ming Qiao and Xi Hu, who contribute to his research endeavors and help drive innovation in the field.

Conclusion

Bo Luo's contributions to SOI device technology exemplify the spirit of innovation in the semiconductor industry. His patent and ongoing research efforts highlight the importance of advancements in display technology.