Jiangsu, China

Bo Li

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignees: Flex Ltd., Nanjing University of Posts and Telecommunications. Active years: 2021-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bo Li. Retrieved from https://idiyas.com/inventor/bo-li-zxa1lhir

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 4.4

ph-index = 1


Company Filing History:


Years Active: 2021-2022

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2 patents (USPTO):Explore Patents

Title: Bo Li: Innovator in Reconfigurable Technology

Introduction

Bo Li is a prominent inventor based in Jiangsu, China. He has made significant contributions to the field of technology, particularly in the development of innovative electronic components. With a total of 2 patents, his work showcases a blend of creativity and technical expertise.

Latest Patents

One of Bo Li's latest patents is the "Reconfigurable wideband phase-switched screen based on artificial magnetic conductor." This invention discloses a reconfigurable wideband phase-switched screen (PSS) that utilizes an artificial magnetic conductor (AMC). The gap capacitance between patches is controlled by adjusting the capacitance of varactors, allowing for multiple continuous frequency points. The phase difference between two adjacent frequency bands ranges from 143° to 217°, enabling the periodic structure to absorb incident electromagnetic waves across a wide frequency band. This broadband PSS achieves a relative bandwidth of 45.2%. The AMC structure is noted for its simplicity and ease of processing, with a thickness less than one twentieth of the working wavelength, significantly reducing size and costs.

Another notable patent is the "System in package with double side mounted board." This improved SiP structure includes one or more interposers that create a center cavity for mounting electronic components. The design provides a reduced footprint without the need for laser drilling, exposed molding, or double side molding, showcasing Bo Li's innovative approach to electronic packaging.

Career Highlights

Bo Li has worked with esteemed institutions such as Nanjing University of Posts and Telecommunications and Flex Ltd. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technology.

Collaborations

Throughout his career, Bo Li has collaborated with talented individuals, including Yumei Chang and Lin Wang. These partnerships have fostered a creative environment that has led to the development of groundbreaking inventions.

Conclusion

Bo Li's contributions to technology through his innovative patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in electronic components and systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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