Hong Kong, China

Bo Jiu Wu

This inventor holds 1 USPTO granted patent. Top assignee: Hong Kong Cheung Tat Electrical Co. Ltd.. Active years: 2005.


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 44(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Bo Jiu Wu: Innovator in Electronic Cooling Systems

Introduction

Bo Jiu Wu is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic cooling systems. His innovative approach has led to the development of a unique patent that addresses the challenges faced by electronic components in terms of heat management.

Latest Patents

Bo Jiu Wu holds a patent for an "Integrated fluid cooling system for electronic components." This advanced cooling system is designed specifically for electronic components, such as the central processing unit of a computer. The system features an integrated unit that includes a radiation housing, an absorption housing with a coolant storage unit, an absorption layer positioned between the coolant storage unit and the electronic component, and a circulation generation unit. This design facilitates the flow of coolant from the storage unit to the absorption layer and back, ensuring efficient cooling of electronic components.

Career Highlights

Bo Jiu Wu is currently employed at Hong Kong Cheung Tat Electrical Co. Ltd. His work at this company has allowed him to further develop his innovative ideas and contribute to advancements in electronic cooling technology. His dedication to improving electronic component performance is evident in his patent and ongoing projects.

Collaborations

Bo Jiu Wu collaborates with talented individuals in his field, including Zhong Ming Wu and Jia Ju Zhang. These partnerships enhance the creative process and lead to more innovative solutions in electronic cooling systems.

Conclusion

Bo Jiu Wu is a prominent inventor whose work in integrated fluid cooling systems has the potential to revolutionize the management of heat in electronic components. His contributions are significant in advancing technology and improving the efficiency of electronic devices.

Profile summary based on public USPTO records.
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