This inventor holds 1 USPTO granted patent. Top assignees: Korea Advanced Institute of Science and Technology, Wavenics Inc.. Active years: 2012.
Company Filing History:
1 out of 2,781 
1 out of 6 Years Active: 2012
Title: Bo-In Son: Innovator in Photonic Device Technology
Introduction
Bo-In Son is a notable inventor based in Gumi, South Korea. He has made significant contributions to the field of photonic devices, particularly through his innovative designs that enhance efficiency and functionality. His work is characterized by a focus on improving heat release in photonic device packaging.
Latest Patents
One of Bo-In Son's key patents is the "Metal-based photonic device package module." This invention is designed to greatly improve heat releasing efficiency while implementing a thin package. The module includes a metal substrate shaped like a plate, a metal oxide layer with a mounting cavity, a photonic device mounted within this cavity, and a reflecting plane formed on the inner surface of the mounting cavity.
Career Highlights
Throughout his career, Bo-In Son has worked with prominent organizations such as Wavenics Inc. and the Korea Advanced Institute of Science and Technology. His experience in these institutions has allowed him to collaborate with other experts in the field and further his research in photonic technologies.
Collaborations
Some of his notable coworkers include Young-Se Kwon and Kyoung-Min Kim. Their collaborative efforts have contributed to advancements in photonic device technology.
Conclusion
Bo-In Son's innovative work in the development of metal-based photonic device packages showcases his commitment to enhancing technology in this field. His contributions are paving the way for future advancements in photonic devices.