Bo-in Noh

Title: Bo-in Noh: Innovator in Semiconductor Technology

Introduction

Bo-in Noh is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of Bo-in Noh's latest patents involves a metal pillar in a film-type semiconductor package. This innovative design includes a metal lead portion arranged on a film substrate, a semiconductor chip with a pad, and a bump that connects the metal lead portion to the pad of the semiconductor chip. The bump features a metal pillar on the pad, which consists of a first metal and a soldering portion that covers the entire surface of the metal pillar. This soldering portion is bonded to the metal lead portion and includes both the first metal and a second metal that differs from the first.

Career Highlights

Bo-in Noh is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the development of advanced electronic devices.

Collaborations

Throughout his career, Bo-in Noh has collaborated with notable colleagues, including Jung-woo Kim and Woon-bae Kim. These collaborations have fostered innovation and have been instrumental in the success of their projects.

Conclusion

Bo-in Noh is a key figure in the semiconductor industry, with a focus on innovative packaging solutions. His contributions through patents and collaborations continue to shape the future of technology.