logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10354967 B1

PDFFull Text
Date of Patent:
Jul. 16, 2019

Filed:

Mar. 13, 2017

Metal pillar in a film-type semiconductor package

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jung-woo Kim, Osan-si, KR;

Woon-bae Kim, Seoul, KR;

Bo-in Noh, Suwon-si, KR;

Go-woon Seong, Hwaseong-si, KR;

Ji-yong Park, Hwaseong-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05584 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81805 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.

Find Patent Forward Citations

Kim, Jung-woo. (2019). Metal pillar in a film-type semiconductor package (U.S. Patent No. 10354967). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10354967

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…