Tainan, Taiwan

Bo-Hung Lai


Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2014-2025

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7 patents (USPTO):Explore Patents

Title: Bo-Hung Lai: Innovator in Flexible Printed Circuit Board Technology

Introduction

Bo-Hung Lai is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of flexible printed circuit boards, holding a total of 7 patents. His innovative work focuses on curable compositions for inkjet applications, which have advanced the technology in this area.

Latest Patents

One of his latest patents is a curable composition for inkjet, which includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. This composition exhibits excellent flexibility and can withstand voltages greater than 2 kV, even at thicknesses of less than 20 μm. Another notable patent is related to a laminate and its preparation method, which features a transparent substrate, an adhesive layer formed by an adhesive composition, and a metal layer. The adhesive composition contains various compounds that enhance adhesion and stability.

Career Highlights

Throughout his career, Bo-Hung Lai has worked with notable organizations such as Microcosm Technology Co., Ltd and National Cheng-kung University. His experience in these institutions has allowed him to develop and refine his innovative ideas, contributing to advancements in technology.

Collaborations

He has collaborated with talented individuals, including Tang-Chieh Huang and Chih-Te Yen, who have supported his research and development efforts.

Conclusion

Bo-Hung Lai's contributions to the field of flexible printed circuit boards and inkjet technology demonstrate his innovative spirit and dedication to advancing engineering solutions. His patents reflect a commitment to excellence and a vision for the future of technology.

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