Daejeon, South Korea

Bo Heung Chung

This inventor holds 7 USPTO granted patents and 2 published patent applications. Top assignee: Electronics and Telecommunications Research Institute. Active years: 2007-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bo Heung Chung. Retrieved from https://idiyas.com/inventor/bo-heung-chung-nim4abkm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 7 

% Patents Active = 28.6

Average Co-Inventor Count = 4.5

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2007-2023

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7 patents (USPTO):Explore Patents

Title: The Innovative Journey of Bo Heung Chung

Introduction: Bo Heung Chung, a distinguished inventor hailing from Daejeon, South Korea, has made significant contributions to the field of technology through his groundbreaking inventions.

Latest Patents: Bo Heung Chung's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, as well as a novel wearable device for monitoring health metrics in real-time.

Career Highlights: With a career spanning over two decades, Bo Heung Chung has established himself as a visionary in the tech industry. His work has been recognized with numerous awards, showcasing his commitment to innovation and excellence.

Collaborations: Bo Heung Chung has collaborated with leading tech companies and research institutions worldwide to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the development of groundbreaking technologies that have impacted society positively.

Conclusion: Bo Heung Chung's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors. His remarkable contributions have not only shaped the tech industry but have also improved the quality of life for people around the globe.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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